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Engineering Change Notification

Public | Finalized Published: 10 November 2010 - Reference: 39_2010_ECN

TAGS: [Mechanical]

Manufacturing process change - HM 20T07 NMD Touch Screen models

Hatteland Display hereby informs about changes for the following model(s):
HM 20T07 NMD-xx

HM 20T07 NMD-xx

Changes:

- Applies to HM 20T07 NMD-C7 and HM 20T07 NMD-C8 models.
- Top and bottom layers of the touchscreen are held together via a double sided pressure sensitive gasket. Current gasket adhesive is replaced by a more aggressive gasket. This gasket will help to keep the top layer of the touchscreen tighter when the part is subjected to 55C temperature.
- Lamination process is modified by adding heat in order to increase the adhesive bond between the layers. This will create added adhesive bond between layers and will keep the top layer tight and prevent loosening when exposed to 55C temperature.
- Making the bond between internal touch layers stronger shall not have any impact on the qualifications. It will, increase touchscreen's strength and prevent it from puckering when exposed to high temperature.

Contact:

For further enquiries regarding this Engineering Change Notification, please contact Support at Hatteland Technology AS.

Matching products online:

HM 20T07 NMD-xx

Implemented by:

________________________________

Frode Grindheim
VP Products
Hatteland Technology AS

Read and Understood by:

________________________________

(Your name)
(Your company)

Last revised: 28 August 2024