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Engineering Change Notification

Public | Finalized Published: 2 February 2023 - Reference: 07_2023_ECN

TAGS: [Electrical]

HT B30 update due to component availability for motherboard

Hatteland Technology AS hereby informs about changes for the following model(s):
HT B30xx xxx-xxx-xxxxxx

Notice: Customized models are ALSO affected by this Engineering Change Notification.

HT B30xx xxx-xxx-xxxxxx

Effective from:

Affects current orders and backlogs.
Gradual implementation from:
HT B30 with Celeron CPU: March - 2023
HT B30 with i5 CPU: August - 2023
HT B30 with i7 CPU: March - 2023

Contact your sales representative for actual date of implementation.

Changes:

- TPM chip: SLB 9665TT2.0 FW5.62 replaced by SLB 9665XT2.0 FW5.63
- Internal VGA support (DVI-I) re-introduced, no supply issues of VGA chip.

Additional information:

Tested and approved according to Hatteland Techology processes. IEC 60945 and IACS-E10 approvals maintained.

NOTE:
TPM chip, new chip comes with firmware version FW5.63.
Hatteland Technology deliver systems with both FW5.62 and FW5.63 firmware version pre-installed, with no known issues for any of the versions.
According to our knowledge, the change in FW version will not affect the application software. The main purpose for FW5.63 is to comply to Win10 RS5 WHQL requirements.

Contact:

For further enquiries regarding this Engineering Change Notification, please contact Support at Hatteland Technology AS.

Matching products online:

HT B30Gx STC-xxx-Mxxxxx
HT B30Kx STC-xxx-Exxxxx

Implemented by:

________________________________

Frode Grindheim
VP Products
Hatteland Technology AS

Document sent to customers.

Reference: MAI/225070

Last revised: 28 August 2024